Wireless Microwave Power Housings

TO-Style Power Transistor Packages for RF and Microwave Product Overview Our TO-style (Transistor Outline) power packages are hermetically sealed, high-reliability solutions for housing discrete RF power transistors. These classic electric packages feature a robust metal header (base) for excellent thermal dissipation, with leads passing through glass-to-metal or ceramic-to-metal seals to provide isolated electrical connections. This design is optimized for high-power applications and provides a rugged, hermetic enclosure that is trusted in the most demanding industrial, military, and aerospace systems. We offer a range of standard JEDEC outlines, including TO-3, TO-254, TO-257, and TO-258. Technical Specifications Parameter Specification Package Types TO-3, TO-254, TO-257, TO-258, and custom variants  Base Material WCu, MoCu, or Oxygen-Free Copper (TU1)  Optional Heat Sink Can be integrated with a Beryllium Oxide (BeO) ceramic heat sink for maximum thermal performance …

Heat Sink Material Ceramic IC Packaging Electric Ceramic Packaging Wireless RF Packaging Kinetic Energy Materials