CSOP48 Packages for Integrated Circuits

CSOP-48: 48-Lead Ceramic Small Outline Package Product Overview The CSOP-48 is a high-pin-count, 48-lead Ceramic Small Outline Package designed for complex integrated circuits that require both a compact surface-mount footprint and high reliability. This package provides a hermetically sealed environment, superior thermal performance, and robust mechanical construction, making it an ideal choice for advanced ICs in demanding sectors such as telecommunications, industrial automation, and aerospace. It is a significant reliability upgrade over comparable plastic packages like SSOP or TSSOP. Technical Specifications Parameter Specification (Model: CSOP48E) Lead Count 48 Lead Pitch 0.5 mm Body Material Multilayer Alumina (Al₂O₃) Ceramic Lead Material / Finish Kovar / Gold (Au) over Nickel (Ni) Die Cavity Dimensions (A x B) 5.50 mm x 5.20 mm Overall Dimensions (C x D) 12.56 mm x 7.82 mm Sealing Method Au-Sn Solder Seal (Hermetic) Compliance Designed to meet MIL-STD-…

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