lcc20 Packages for Integrated Circuits

CLCC-20: 20-Pin Ceramic Leadless Chip Carrier Product Overview The CLCC-20 is a 20-terminal Ceramic Leadless Chip Carrier, a high-performance surface-mount package engineered for maximum density and excellent high-frequency performance. By eliminating leads and using metallized terminals on the package body, the CLCC offers the shortest possible signal path from the IC to the PCB, minimizing parasitic inductance. Its monolithic ceramic construction provides superior thermal dissipation and the capability for a true hermetic seal, making it an outstanding choice for demanding applications in aerospace, defense, and telecommunications where performance and reliability are paramount. Technical Specifications Parameter Specification (Model: LCC20) Terminal Count 20 Terminal Pitch 1.27 mm Body Material Multilayer Alumina (Al₂O₃) Ceramic Terminal Plating Nickel (Ni) / Gold (Au) for excellent solderability and wire bonding Body Dimensions SQ 9.0 mm Die Cavity Dimensions S…

Heat Sink Material Ceramic IC Packaging Electric Ceramic Packaging Wireless RF Packaging Kinetic Energy Materials