48PIN Packages for Wireless Communications

CQFP48: 48-Lead Ceramic Quad Flat Package for RFICs Product Overview The CQFP48 is a 48-lead Ceramic Quad Flat Package providing a high-reliability, hermetically sealed solution for complex Radio Frequency Integrated Circuits (RFICs) and ASICs. As a key component in our Wireless RF Packaging portfolio, the CQFP is designed for surface-mount applications requiring a moderate pin count with excellent electrical and thermal performance. Its multi-layer ceramic construction and compliant gull-wing leads ensure signal integrity and mechanical robustness, making it an ideal choice for housing sophisticated ICs in wireless communication, aerospace, and industrial systems. Technical Specifications Parameter Specification (Example: CQFP48E) Lead Count 48  Lead Pitch 0.5 mm or 0.8 mm options available  Body Material Multilayer Alumina ($Al_2O_3$) Ceramic Lead Frame Material Kovar (Fe-Ni-Co Alloy) Example Body Dimensions SQ 10.50 x 10.50 mm (for 0.5mm pitch)  Example Die Cavi…

Heat Sink Material Ceramic IC Packaging Electric Ceramic Packaging Wireless RF Packaging Kinetic Energy Materials