Optical communication encapsulation shell gold finger

Custom Ceramic Substrates with Gold Finger Edge Connectors Product Overview Revolutionize your module design with our custom Ceramic Substrates featuring integrated "gold finger" edge connectors. This innovative solution combines the superior thermal and electrical properties of a ceramic base with the simplicity of a card-edge interface, eliminating the need for wire bonds or lead frames for board-level connection. By metallizing the edge of the substrate (castellation), we create a direct surface-mount connection that is robust, reliable, and offers unparalleled high-frequency performance. This technology is a key enabler for the miniaturization and performance enhancement of next-generation optical and RF modules. Technical Specifications Parameter Specification Substrate Materials High-Purity Alumina (99.6% $Al_2O_3$), Aluminum Nitride (AlN) Metallization System Ti/Pt/Au (Titanium/Platinum/Gold) for superior adhesion and bondability Gold Finger Pitch Fully customizab…

Heat Sink Material Ceramic IC Packaging Electric Ceramic Packaging Wireless RF Packaging Kinetic Energy Materials