CSOP28 Ceramic Compact Housings

CSOP-28: 28-Lead Ceramic Small Outline Package for High-Performance ICs Product Overview The Ceramic Small Outline Package (CSOP) combines the space-saving benefits of surface-mount technology with the unparalleled reliability of a hermetic ceramic enclosure. Our CSOP-28 is a 28-lead package designed for high-performance analog, mixed-signal, and digital ICs that require robust environmental protection and excellent thermal stability. Featuring compliant gull-wing leads for durable solder joints and a multi-layer alumina body, this package is the premier choice for demanding applications in the automotive, industrial, and telecommunications sectors. It provides a significant upgrade in reliability and performance over standard plastic SOIC packages. Technical Specifications Our CSOP-28 packages are engineered for precision and reliability. Parameter Specification (Model: CSOP28C) Lead Count 28 Lead Pitch 0.635 mm Body Material Multilayer Alumina (Al₂O₃) Ceramic Lead Ma…

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