Multilayer material molybdenum and copper

CPC (Cu/MoCu/Cu) Composites for High-Power Applications Our Copper-Molybdenum Copper-Copper (CPC) composites represent the next generation of laminated thermal management materials. By using a high-conductivity Molybdenum-Copper (MoCu) alloy as the core material, CPC delivers significantly higher thermal performance than traditional CMC. This makes it the premier Heat Sink Material for the most demanding high-power applications, including 5G infrastructure and advanced power electronics, where efficient heat dissipation is paramount for performance and reliability. Technical Specifications Grade Composition CTE (10⁻⁶/K) Thermal Conductivity (W/m·K) Density (g/cm³) Tensile Strength (MPa) CPC141 Cu/Mo70Cu/Cu 7.3-10.0 // 8.5 220 9.5 380 CPC232 Cu/Mo70Cu/Cu 7.5-11.0 // 9.0 255 9.3 350 CPC111 Cu/Mo70Cu/Cu 9.5 260 9.2 310 CPC212 Cu/Mo70Cu/Cu 11.5 300 9.1 230 Product Images and Videos Product Features and Advantages Superior Thermal Conductivity With a thermal conductivity 2…

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