Molybdenum-copper alloy customizable gold-plated parts

Custom Gold-Plated Molybdenum-Copper (MoCu) Components We provide custom-fabricated Molybdenum-Copper (MoCu) components with high-quality gold plating. These parts combine the excellent thermal properties of MoCu as a Heat Sink Material with the superior solderability and corrosion resistance of a gold surface finish. This makes them an ideal choice for high-reliability Optoelectronic Packaging and microelectronic assemblies where robust and stable connections are critical. Technical Specifications Base Material: MoCu (All grades available, from Mo50Cu50 to Mo90Cu10) Plating Process: Electrolytic Nickel (Ni) barrier layer followed by Gold (Au) top layer. Nickel Thickness: 1-5 μm (customizable) Gold Thickness: 0.3-1.0 μm (customizable for soldering or wire bonding) Adhesion: Excellent layer adhesion, verified by heat treatment testing. Product Images and Videos Product Features and Advantages Superior Solderability The gold-plated surface provides an excellent, oxide-free surface fo…

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