Metallized Ceramics for Electronic Applications

High-Performance Metallized Ceramic Substrates for Advanced Electronic Applications Product Overview Our metallized Ceramic Substrates are the foundation for next-generation microelectronics. By applying high-purity metallic thin films to advanced ceramic materials like Alumina ($Al_2O_3$) and Aluminum Nitride (AlN), we create high-performance interconnect platforms. These substrates provide a superior solution for applications demanding excellent thermal management, high-frequency electrical performance, and exceptional reliability. From complex RF modules to High-power Laser Packaging, our substrates offer a robust and stable base for mounting and connecting sensitive semiconductor devices, enabling higher power densities and miniaturization. Technical Specifications: Material Properties Parameter Alumina (99.6% $Al_2O_3$) Aluminum Nitride (AlN) Thermal Conductivity (W/m·K) ~27 >170 CTE (ppm/K, RT-400°C) 7.0 4.6 (Closely matches Silicon) Dielectric Constant (@1MHz)…

Heat Sink Material Ceramic IC Packaging Electric Ceramic Packaging Wireless RF Packaging Kinetic Energy Materials