Electronic Ceramics for Communication

High-Speed Optoelectronic Packaging: Metal-Wall Housings for Communication Devices Product Overview Our metal-wall, ceramic-insulator housings are the gold standard for high-performance Optoelectronic Packaging. This construction methodology provides the ultimate combination of rugged mechanical protection and high-fidelity electrical performance. The metal body acts as a durable, hermetic shield and an excellent heat sink, while the integrated alumina ceramic feedthroughs provide superior electrical isolation for high-speed signal and DC bias pins. Engineered to solve the complex interconnection challenges between the semiconductor chip and external circuitry, these packages support data rates from 2.5Gbps up to 400Gbps, making them the ideal choice for the entire spectrum of optical communication applications. Technical Specifications Parameter Specification Supported Data Rates 2.5Gbps, 10Gbps, 25Gbps, 40Gbps, 100Gbps, and 400Gbps Impedance Control Designed for 50Ω char…

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