40-Pin Optical Communication Package Tube Shell

40-Pin Ceramic Quad Flat Package (CQFP) for Optical and RF Modules Product Overview The 40-Pin Ceramic Quad Flat Package (CQFP) is a high-density, surface-mount solution for complex integrated circuits and multi-chip modules. As a premier example of advanced Ceramic IC Packaging, the CQFP provides a hermetically sealed cavity to protect sensitive semiconductor devices while offering a high number of I/O connections in a compact footprint. The gull-wing leads provide compliant connections to the printed circuit board, absorbing thermal stress and ensuring a reliable solder joint. This package is ideal for mixed-signal, RF, and optical applications where performance, density, and reliability are paramount. Technical Specifications Parameter Specification Pin Count 40 Lead Pitch Options available (e.g., 0.8mm, 0.65mm, 0.5mm) Body Material Multilayer Alumina ($Al_2O_3$) Ceramic (Black or White) Lead Frame Material Kovar (Fe-Ni-Co Alloy) Plating Nickel (Ni) underplate wit…

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