Drilled Aluminum Nitride Ceramic Substrate With Hole

Drilled Aluminum Nitride Ceramic Substrate With Hole Product Overview Puwei's drilled aluminum nitride (AlN) ceramic substrates with precision holes represent the pinnacle of advanced thermal management solutions for demanding electronic packaging applications. These specialized substrates combine the exceptional thermal conductivity of aluminum nitride with strategically placed holes for enhanced functionality in high-frequency modules and power electronics. Engineered for superior performance in microelectronics packaging, our drilled AlN substrates provide optimal thermal dissipation, excellent electrical insulation, and precise mechanical stability. The integrated holes serve multiple purposes including wire-bonding connections, coolant flow channels, and gas release pathways during manufacturing processes. Technical Specifications Material Composition: High-purity Aluminum Nitride (AlN) Thermal Conductivity: Standard ≥175W/m·K, High-grade ≥200W/m·K Thickness Range: 0.10mm to…

Alumina Ceramic Robotic Arm Alumina Ceramic Structural Components AlN Ceramic Components AlN Ceramic Substrate AlN Ceramic Disc