Aluminum Nitride Ceramic Substrate For Thick Film Circuit

Aluminum Nitride Ceramic Substrate for Thick Film Circuits Puwei's specialized Aluminum Nitride Ceramic Substrates provide the ideal foundation for advanced thick film circuits, combining exceptional thermal management with superior electrical performance. Engineered specifically for demanding electronic packaging and microelectronics packaging applications, these substrates deliver reliable performance in high-power and high-frequency environments. Core Advantages Exceptional Thermal Conductivity: 170-230 W/(m·K) for superior heat dissipation Superior Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm Chemical Stability: Resistant to acids, alkalis, and corrosive environments Thermal Expansion Matching: Compatible with thick film materials Surface Optimization: Ideal platform for thick film printing and sintering Technical Specifications Material Properties Thermal Conductivity: 170-230 W/(m·K) Volume Resistivity: >10¹⁴ Ω·cm Dielectric Constant: 8.5-9.0 @ 1MHz…

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