Aluminum Nitride Ceramic Substrate For Thick Film Circuit

Aluminum Nitride Ceramic Substrate for Thick Film Circuits Puwei's Aluminum Nitride Ceramic Substrates are engineered as the superior foundation for advanced thick film hybrid microcircuits. By combining exceptional thermal conductivity with outstanding electrical insulation, they solve critical thermal management challenges in high-performance electronic packaging and microelectronics packaging. Core Advantages Superior Heat Dissipation: Thermal conductivity of 170-230 W/(m·K) for reliable power devices operation. Excellent Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm, ideal for high-frequency modules. Robust & Stable: High chemical resistance and thermal expansion matching with thick film materials. Optimized for Manufacturing: Surface finishes tailored for precise thick film printing and sintering. Technical Specifications Material Properties Our AlN substrates guarantee performance with the following key properties: Thermal Conductivity ranging 170-23…

Alumina Ceramic Robotic Arm Alumina Ceramic Structural Components AlN Ceramic Components AlN Ceramic Substrate AlN Ceramic Disc