Advanced Electronic Potting Compound for Reliable Protection

HONG YE SILICONE's Electronic Potting Compound, also known as silicone encapsulant, is a highquality potting material with waterproof, moistureproof, thermal conductive, flameretardant and insulating properties. It cures into a solid form after adding a curing agent, effectively protecting electronic components. Compatible with PC, PMMA, PCB and CPU, it offers excellent adhesion and thermal stability. Available in addition curing and condensation curing types, it operates from 60℃ to 220℃, serving diverse industries worldwide with over 20 years of manufacturing expertise.    Product Overview Electronic Potting Compound (Silicone Potting Compound) is a core product of HONG YE JIE, a global leading silicone manufacturer with ISO9001, UL and CE certifications. This versatile encapsulant, also called electronic encapsulation adhesive, is designed to seal, fill and protect electronic components. It integrates multiple functions to shield components from moisture, dust, corrosion and…

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