Durable Electronic Encapsulation Material

HONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a high-grade liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures into a solid protective layer after mixing with a curing agent, boasting excellent adhesion to PC, PMMA, PCB and CPU, and stable performance from -60℃ to 220℃. Available in addition and condensation curing types, it’s a core product matching our RTV 2 Silicone Rubber, Pad Printing Silicone, Food Grade Mold Silicone and Liquid Silicone, providing reliable protection for electronic components across global industries.    Product Overview Our Electronic Potting Compound is a professional silicone-based encapsulation material for electronic components, also known as electronic glue or silicone encapsulant. Mixed with a curing agent, the liquid colloid solidifies to form a tight protective layer, realizing comprehensive sealing, filling and pressure-pro…

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