IC PASTE 183°C flux and solder paste

Solder joints are full and bright, with high surface insulation resistance. No need to clean lead solder paste. Strong adhesion. Evenly spread. Not easy to oxidize. SOLDER SPOT BRIGHT   GOOD CONDUCTIVITY,GOOD TIN DROP,SOOD PRINTING FLUIDITY XeredEX,FULL SOLDER JOINT,STRONG WETTABILITY   The solder joints are bright and full, without false solder joints. The solder joints are bright and full. Good solderability. Excellent continuous printing line. Less residue after welding, transparent appearance, high insulation resistance, no corrosion, no need to clean Strong adhesion, not easy to collapse   Long continuous printing time, basically no collapse after several hours of printing, small viscosity change, patch is not easy to shift Good wettability and good , soldering performance,suitable for wide reflow soldering temperature range   SMT patch Low tin content, strong tinning ability, full and bright solder joints   Chip tinning,Good conductivity, strong ti…

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