Hebei Fangsi Precision Machinery Manufacturing Co., Ltd. focuses on precision machining of high-purity metal components for semiconductor industry. This copper backplate is a core product of Semiconductor Copper Target Materials. It is precisely manufactured via 5-axis turning technology for CNC Custom Machining Parts, and we adopt mature processing technology of Alloy Welding Machining Parts to realize seamless bonding between target blank and copper backplate.
Fabricated from high-purity TU1 oxygen-free copper and C18000 copper alloy, this disc backplate features evenly distributed mounting holes around the edge. Its surface is mirror-finished with concentric turning textures, fully complying with strict dimensional and flatness requirements for semiconductor applications. With thermal conductivity above 400W/mK, excellent electrical conductivity, stable weldability and proper mechanical rigidity, it serves as structural support, heat dissipation channel and conductive path for tar…