Alumina Ceramic Special-shaped Part

Alumina Ceramic: Alumina Ceramic Special-shaped Part   Alumina electronic ceramic components use a specialized process to bond copper foil directly to the surface (one or both sides) of an (Al2O3) ceramic substrate at high temperature. The obtained ultrathin composite substrate has excellent electrical insulation, high thermal conductivity, excellent soft connection performance and high contact strength. Similar to printed circuit boards (PCBs), they can be arranged into various shapes to enhance current-carrying capacity. Ceramic PCBs like Silitong have become the foundational material for large-scale power electronics circuit structures and interconnect technologies.   The basic manufacturing process of alumina ceramics includes four aspects: powder preparation, molding method, sintering technology, finishing and packaging. Extrusion molding is to put the ceramic slurry into an extruder and apply pressure to form a green body.   Note:We offer a wide variety of sizes and thicknesse…

Silicon Nitride Ceramic Ceramic Backing Alumina Ceramic